Student wins $2,000 Richard C. Ryan Packaging Education Scholarship

By Jenny Eagle

- Last updated on GMT

Related tags Packaging

Alexandra Slagle
Alexandra Slagle
Alexandra Slagle from Michigan State University, US, has won a $2,000 Richard C. Ryan Packaging Education Scholarship in association with PMMI, The Association for Packaging and Processing Technologies and Dorner Manufacturing.

The student beat 25 applicants thanks to her entry, which the judges said ‘focused on a learning that extended beyond her packaging major coursework to encompass engineering and physics, and emphasized the role packaging can play in battling hunger in developing countries’.

Scholarships in the packaging industry

Every year there are more and more applicants for scholarships in the packaging industry,” ​said Maria Ferrante, VP, Education & Workforce Development, PMMI.

“This year was no exception, and Alexandra certainly raised the bar for future applicants​.”

In her application letter Slagle wrote: “I would like to gain a stronger technical base to further understand the details and science behind packaging. I also look forward to enhancing my knowledge through my current internship with General Mills​.

Self-sustaining food packaging for third world countries

My first couple of years as a packaging student has made me more eager to continue my studies. I constantly find myself examining packaging in stores and looking for indicators of how they were molded, blown or formed​.

My aspiration is to work on self-sustaining food packaging for third world countries that struggle to keep people nourished. The hope is to create a package that keeps food safe while allowing it to go from frozen to ready-to-eat with just the pull of a tab​.

The Richard C. Ryan Packaging Education Scholarship was established in memory of Richard C. Ryan, former president and CEO of Dorner Manufacturing Corporation, a PMMI member company.

It is one of several scholarships administered by the PMMI Foundation, which provides more than $100k annually in scholarships to students and has provided more than $1.5m in support since 1998.

Related topics Processing & Packaging

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