Yellow team reigns in PACK EXPO contest
The competition pits teams of packaging students against each other in a skills competition at PACK EXPO Las Vegas, sponsored by PMMI: the Association for Packaging and Processing Technologies. The winning team members were Abbey Phillips from Rochester Institute of Technology (RIT), Katie Thompson of Clemson University; and Brian Wells of Rutgers University.
“The students had a great time;” said Maria Ferrante, vice president, Education & Workforce Development, PMMI. “While they were here at PACK EXPO, they got to see where their packaging degrees can take them and to consider new ideas for their careers.”
The annual Amazing Packaging Race was sponsored by 20 PACK EXPO Las Vegas exhibitors: 3M; ADCO Manufacturing; Arrowhead Systems, Inc.; Bosch Packaging Technology, Inc.; Collamat AG; Con-Pearl NA, Inc.; Cozzoli Machine Company; Dorner Mfg.; Emulate3D Ltd.; FilmLOC, Inc.; Garvey Corporation; Intelligrated; Label Technology Inc.; Langguth America; Millwood Incorporated; Morrison Container Handling Solutions; Packsize, LLC; Schneider Packaging Equipment Co., Inc.; Shurtape Technologies, LLC.; Spee-Dee Packaging Machinery; Starview Packaging Machinery, Inc.
A total of seven PMMI Partner Schools participated in this year’s contest: Cal Poly San Luis Obispo, Clemson University, Purdue University Calumet, Rochester Institute of Technology, Rutgers University School of Engineering, San Jose State University and Virginia Tech.
